+xI assume you mean 'powder' bound mat? If so, then yes, this combined with a high temperature epoxy laminating resin would be perfect. There's really no need to vacuum bag a mould though - you shouldn't be worried about the weight of the mould. Vacuum bagging moulds adds a whole new level of complications and really doesn't improve the final product at all, so just go with wet-lay for the moulds.
Yes that was meant to say powder bound, wasn't too fussed about the mould weight just wanted a good solid mould but yes be fine without bagging + as you say will be easier, thanks 😀
+xThe most important thing to remember is use an epoxy gelcoat and resin that is suitable for the high temperature cures and also ensure you have done the full postcure cycle before using the moulds.
Yes I was intending on the EG160 + EL160, the oven I'm doing will be controlled using an arduino chip, so have a mate going through the coding of that to get it all working to have have all the ramp + soak features
Llooking at the El160 TDS the initial cure is 65 degrees before removing the plug + then the post cure cycle begins, in light of this is there likely to be any issues using the 3mm polypropylene board for split flanges as the HDT is 70 degrees?
Thanks